Copper targets are essential materials for Physical Vapor Deposition (PVD) processes, known for their outstanding electrical and thermal conductivity, chemical stability, as well as high malleability, facilitating easy processing and shaping to create targets of various shapes and sizes to suit different sputtering equipment. They are widely utilized across electronics, semiconductor, and optical industries.
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Product Name |
Copper (Cu) Sputtering Target |
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component |
Cu |
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appearance |
Copper color, flat or cylindrical |
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Purity (%) |
99.99% |
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Specification (mm) |
ϕ125×ϕ155×L1188、ϕ125×ϕ171×L2940、W1130×L1200×T10 |
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Impurities ≤ (ppm) |
Fe |
Pb |
As |
Ni |
Sb |
Mn |
Mg |
Sn |
Zn |
Bi |
Sum |
30 |
10 |
20 |
10 |
10 |
10 |
10 |
10 |
10 |
10 |
100 |