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  • Copper (Cu) Sputtering Target
  • Copper (Cu) Sputtering Target

Copper (Cu) Sputtering Target

Copper targets are essential materials for Physical Vapor Deposition (PVD) processes, known for their outstanding electrical and thermal conductivity, chemical stability, as well as high malleability, facilitating easy processing and shaping to create targets of various shapes and sizes to suit different sputtering equipment. They are widely utilized across electronics, semiconductor, and optical industries.

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Product details

Product Name

Copper (Cu) Sputtering Target

component

Cu

appearance

Copper color, flat or cylindrical

Purity (%)

99.99%

Specification (mm)

ϕ125×ϕ155×L1188ϕ125×ϕ171×L2940W1130×L1200×T10

Impurities ≤ (ppm)

Fe

Pb

As

Ni

Sb

Mn

Mg

Sn

Zn

Bi

Sum

30

10

20

10

10

10

10

10

10

10

100